MWM-850 - Up to 8", simple-to-use, adjustable temperature, roller mechanism, UV tape capable.
FEATURES
Chucks - Available for All Standard 8” & 12"
Wafer/Film Frame Sizes. Custom chucks and
Non-Contact chucks for all applications.
Desktop Design - minimizes space requirements.
Built-in Vacuum Generator.- no vacuum line required.
Closed-loop, Digital Platen Temperature Control.
Safe, Simple, Accurate Operation.
Wafer alignment Options - available (reduces dicing
system alignment time).
TECHNOLOGY
TODO!!!
SPECIFICATIONS
Dimensions: (H x W x D) 12” x 15.5” x 31.5”
(30.5 x 39.5 x 80 cm).
Weight: 70 lbs (32 kg).
Line Voltage: 110 - 120 Vac, 50/60 Hz, Single Phase, or
220 - 240 Vac, 50/60 Hz, Single Phase. Air: 5 bar, c.d.a.
OPTIONS
*UV tape backing separator.
* ESD eliminator.
* Non-contact mounting chuck (custom-manufactured
per application requirements).
* Custom chucks to enable the mounting of
non-standard applications on existing MWM-850
systems. One system for many applications.
MWM - 851
MWM-851- Up to 8", simple-to-use, adjustable temperature, roller mechanism, accurate X,Y,Theta positioning, UV tape capable.
FEATURES
Compact Desktop Design - A compact system, the UV-956 does not require nitrogen or other special utility hookups, allowing for simple installation. Simply plug it in and it is ready to go.
* Uses standard wafer frame sizes, up to 8”.
* Compact desktop design.
* Temperature controlled platen.
* Wafer alignment options available (reduces dicing system setup time).
* CE Approval Option.
TECHNOLOGY
TODO!!!
SPECIFICATIONS
Dimensions: (HxWxD) 12” x 15.5” x 31.5” (30.5 x 39.5 x 80 cm) .
Weight: 70 lbs. (32 kg) .
Line Voltage: 110-120 Vac, 60 Hz, Single Phase
220-240 Vac, 50 Hz, Single Phase
Air Pressure: 5 bar CDA.
Mounts wafers/substrates on dicing frames up to 12", simple-to-use, adjustable temperature, roller mechanism,
UV tape capable.
FEATURES
Chucks - Available for All Standard 8” & 12"
Wafer/Film Frame Sizes. Custom chucks and
Non-Contact chucks provided to meet all
application requirements.
Desktop Design - minimizes space requirements.
Built-in Vacuum Generator.- no vacuum line required.
Closed-loop, Digital Platen Temperature Control.
Safe, Simple, Accurate Operation.
TECHNOLOGY
Robust and Easy-to-Use, simple to set up and operate. With its gas spring-aided cover lifting mechanism and ergonomic design, operators find the MWM-853 system easy-to-use throughout the entire shift. Robust mechanical design means reliable wafer mounting, day-in and day-out.
Requiring only compressed air and electricity, the MWM-853 can be installed and operated in virtually any production environment.
SPECIFICATIONS
Dimensions: (H x W x D) 12” x 21” x 37.5”
(30.5 x 53 x 95 cm ).
Weight: 100 lbs (45 kg).
Line Voltage: 110 - 120 Vac, 50/60 Hz, Single Phase, or
220 - 240 Vac, 50/60 Hz, Single Phase. Air: 5 bar, c.d.a.
OPTIONS
1
1. UV tape backing remover - ejects UV tape backing (cover
sheet) from system to facilitate waste material management.
2. ESD eliminator - ionizer bar eliminates electrostatic charges
on mounting tape to protect ESD-sensitive devices.
3. Non-contact chuck (custom-manufactured, per application) -
reduces mechanical contact between chuck and wafer during
mounting process to protect sensitive wafer lithography
surface.
4. Custom-designed chuck work surfaces to accommodate
VWM-871
Mounts wafers/substrates on dicing frames up to 8", vacuum chamber, programmable tape tension, PLC-controlled operation, safe for wafers down to 4 mils thick.
FEATURES
No roller - non-contact mounting process.
Automatic tape application - with manual tape placement and removal.
Bubble-free tape application - provides improved adhesion.
Mounts bumped wafers.
Virtually eliminates mechanic stress on wafer.
Automatic motorized tape cutting.
Tape tension is controlled and programmable.
TECHNOLOGY
As wafers become thinner and more complex, vacuum mounting technology provides the solution to wafer/frame mounting with minimal physical contact and mechanical force applied. Applying tape in a vacuum environment eliminates air bubbles between the wafer and the tape, providing improved adhesion. This is extremely important when dicing very small dies and applications. Due to its form-fitting characteristics, vacuum wafer mounting is also well suited for use in BGA, CSP and other non-planar surface mounting applications.
SPECIFICATIONS
Dimensions: (H x W x D) 12” x 21” x 37.5”
(30.5 x 53 x 95 cm ).
Weight: 100 lbs (45 kg).
Line Voltage: 110 - 120 Vac, 50/60 Hz, Single Phase or
220 - 240 Vac, 50/60 Hz, Single Phase
Air: 5 bar, c.d.a.
OPTIONS
* ESD eliminator.
* UV tape backing separator.
MWM - 300
MWM-300 Up to 12" (300mm) wafers, vacuum mounting process, programmable tape tension, PLC-controlled operation, safe for wafers down to 6 mils thick.
FEATURES
* No roller used.
* Mounts wafers up to 300mm.
* Bubble-free tape adhesion provides improved adhesion.
* Minimizes mechanical contact with wafer.
* UV Tape capability.
* Automatic motorized tape cutting.
* Tape tension is controlled and programmable.
TECHNOLOGY
TECHNOLOGY
Vacuum Wafer Mounter Technology 300mm wafers are delicate and expensive substrates requiring special handling care and attention.Vacuum technology provides the solution to 300mm wafer/frame mounting with minimal physical contact and mechanical force applied to the wafer.Tape application in a vacuum environment eliminates air bubbles betweenthe wafer and the tape for improved adhesion - extremely important for very thinwafer and small die dicing applications.
SPECIFICATIONS
Dimensions: (H?W?D) 70” x 35.5” x 48” (178.6 x 90 x 122 cm).
Weight: 273 lbs. (124 kg).
Line Voltage: 110-220 Vac, 60 Hz, Single Phase,
220-240 Vac, 50 Hz, Single Phase
Air Pressure: 5 bar CDA.
